Thermo - structural Model of Stacked Field - programmable
نویسنده
چکیده
A new 3-D full-scale thermo-structural finite element model of two-stack FPGA with TSVs, which is developed from an experimentally validated single-stack FPGA model, is proposed. Typical 3-D distributions and evolutions of temperature and von Mises stress on both the active layers and TSVs are presented.
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